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STM1066
Smart voltage supervisor
Features

Operating voltage 2.7 V to 5.5 V Supply current of 1.5 A (typ) Factory-trimmed voltage threshold from 3.2 V to 3.5 V in 50 mV increments 3% voltage threshold accuracy across temperature Enable and inhibit inputs (EN, INH) Power supply transient immunity Current limited output of 15 mA (max) Available in flip chip 6-bump package Operating temperature -30C to +85C
Flip chip (6-bump)
Applications

Portable devices Cell phones/smart phones PDA Palmtops Organizers Portable audio/video players Portable terminals
April 2008
Rev 4
1/20
www.st.com 1
Contents
STM1066
Contents
1 2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 2.2 2.3 Output, OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Enable input, EN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Inhibit input, INH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3 4 5 6 7 8 9
Typical operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 DC and AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Package marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
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STM1066
List of tables
List of tables
Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Operating and AC measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 DC and AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Flip chip 6-bump, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Factory-trimmed thresholds with marking description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
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List of figures
STM1066
List of figures
Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6-bump flip chip connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Application hookup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Supply current vs. supply voltage, VEN = 4 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Supply current vs. temperature, VEN = 4 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Supply current vs. supply voltage, VEN = 0 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Supply current vs. temperature, VEN = 0 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Rising voltage detector threshold vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Threshold hysteresis vs. temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Flip chip 6-bump, package mechanical outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Flip chip tape and reel specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
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STM1066
Description
1
Description
The STM1066 device monitors VCC, and connects OUT to VIN or GND, based on the VCC level (above VTH+ or below VTH- ) and the state of EN and INH inputs. The device offers several voltage thresholds, VTH+ (see Table 8) and it is available in miniature flip chip 6-bump package. Figure 1. Logic diagram
VCC VIN
EN STM1066 INH OUT
GND
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Description
STM1066
Table 1.
Pin descriptions
Pin 1A 1B 1C 2A 2B 2C Symbol VIN EN GND OUT INH VCC Function Supply for output pin (OUT) Enable from USB VBUS Ground Output Active high. Inhibits device Chip supply
Figure 2.
6-bump flip chip connections
A
B
C
A
B
C
1
VIN
EN
GND
2
OUT
INH
VCC
2
OUT
INH
VCC
1
VIN
EN
GND
bottom view, bumps up
top view, bumps down
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STM1066 Figure 3. Block diagram
VIN VCC Current source GND
Description
Band gap
+ OUT Level shifter
EN
Delay 2s
LOGIC VCC
INH
ai13916
Figure 4.
Application hookup
VBUS USB connector R1
USB charging and transceiver circuits VBAT DC-DC step-up converter VCC OUT EN C3 GND
VBOOST
R2
VBAT C1 EN Inhibit control INH GND STM1066 VCC VIN
OUT
ASIC
VCHARGER C2
ai13917
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Operation
STM1066
2
Operation
The STM1066 connects or disconnects the output OUT, from the VIN pin based on the logical combination of the enable input (EN), the inhibit input (INH), and the supply voltage level, VCC (see Table 2 or Figure 11 for more details).
2.1
Output, OUT
If the enable input is in a logic high state and inhibit input is in a logic low state, the output will be connected to VIN input as VCC rises above the VTH+ voltage threshold. Otherwise, the output is connected to ground GND. The output is current limited (see Table 5).
2.2
Enable input, EN
A Logic low on the enable input disconnects the output from VIN and disables the device, which enters a standby mode with very low current consumption (see Table 5).
2.3
Inhibit input, INH
A logic high on the inhibit input disconnects the output from VIN. Table 2. Truth table
VCC VTH+ (rising edge) >VTH- (falling edge) EN(1) x L x H INH x x H L OUT connected to GND connected to GND connected to GND connected to VIN
1. Once the device is disabled by EN input, the VCC must be above VTH+ to reconnect output to VIN.
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STM1066
Typical operating characteristics
3
Typical operating characteristics
Figure 5. Supply current vs. supply voltage, VEN = 4 V
3.0 2.5
Supply Current, ICC (A)
2.0 1.5 1.0 0.5 0.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
TA = -30 C TA = 25 C TA = 0C TA = 85C
Supply Voltage, VCC (V)
ai13942
Figure 6.
Supply current vs. temperature, VEN = 4 V
2.5
Supply Current, ICC (A)
2.0
1.5
1.0 VCC = 2.70 V 0.5
VCC = 3.50 V VCC = 4.25 V VCC = 5.00 V VCC = 5.50 V
-30 -20 -10 0 10 20 30 40 50 60 70 80
0.0
Temperature, TA (C)
ai13943
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Typical operating characteristics Figure 7. Supply current vs. supply voltage, VEN = 0 V
STM1066
0.8 0.7
Supply Current, ICC (A)
0.6 0.5 0.4 0.3 0.2 0.1 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
TA = -30 C TA = 85 C TA = 25 C TA = 0 C
Supply Voltage, VCC (V)
ai13944
Figure 8.
Supply current vs. temperature, VEN = 0 V
0.65
Supply Current, ICC (A)
0.60
0.55
VCC = 2.70 V VCC = 3.50 V
0.50
VCC = 4.25 V VCC = 5.00 V VCC = 5.50 V
0.45 -30 -20 -10 0 10 20 30 40 50 60 70 80
Temperature, TA (C)
ai13945
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STM1066 Figure 9.
Typical operating characteristics Rising voltage detector threshold vs. temperature
Rising voltage detector threshold, VTH+ (V)
3.50
maximum value
3.45 3.40 3.35 3.30
typical value
minimum value
3.25 3.20 -30 -20 -10 0 10 20 30 40 50 60 70 80
Temperature, TA (C)
ai13946
Figure 10. Threshold hysteresis vs. temperature
550
Threshold Hysteresis, VHYST (mV)
maximum value
500 450 400 350
minimum value
300 250 -30 -20 -10 0 10 20 30 40 50 60 70 80
Temperature, TA (C)
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Maximum ratings
STM1066
4
Maximum ratings
Stressing the device above the rating listed in the "Absolute maximum ratings" table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents.
Table 3.
Symbol VCC VIN VEN VOUT VINH TA
Absolute maximum ratings
Parameter Input supply voltage Output source voltage VBUS input Output pin Inhibit pin Operating ambient temperature Storage temperature Electrostatic protection -2000 Electrostatic protection -500 +2000 +500 V V Human body model Charged device model Min -0.2 -0.2 -0.2 -0.3 -0.3 -30 -45 -100 Typ Max +7.0 +7.0 VCC + 0.3 VIN + 0.3 VCC + 0.3 +85 +150 +100 Unit V V V V V C C V Machine model Independent of VCC Series 1M external resistor for protection Remarks
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STM1066
DC and AC characteristics
5
DC and AC characteristics
This section summarizes the operating measurement conditions and the DC and AC characteristics of the device. The parameters in the DC and AC characteristics tables that follow are derived from tests performed under the measurement conditions summarized in Table 4: Operating and AC measurement conditions. Designers should check that the operating conditions in their circuit match the operating conditions when relying on the quoted parameters. Table 4. Operating and AC measurement conditions
Parameter VCC supply voltage Ambient operating temperature (TA) Input rise and fall times Condition 2.7 to 5.5 -30 to 85 5 Unit V C ns
Figure 11. Waveforms
V CC (V BAT )
V TH+ V TH~2.3V ~2.1V
EN VIH EN (VBUS ) EN VIL
INHIBIT
V IN (5V input option)
OUT
Output follows Vin
ai 13919
Note:
VIN assumed to be from 1.6 V to 5.5 V. No VIN means no signal on OUT pin. If there is no VCC then there will be no VIN.
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DC and AC characteristics Table 5.
Sym VCC ICC
STM1066
DC and AC characteristics
Parameter Supply voltage Supply current into VCC pin VEN = 0 V VEN = 4 V VEN = 0 V VEN = 4 V -3% 0.3 VTH+ - VHYST VCC falling from (VTH- + 100 mV) to (VTH- - 100 mV) at 10 mV/s VCC rising from (VTH+ - 100 mV) to (VTH+ + 100 mV) at 10m V/s Allows 2.5 V rail, VBAT or +5 V 2.4 VTH+ Test condition(1) Min 2.7 0.6 1.5 Typ Max 5.5 1 15 5 15 +3% 0.5 Unit V A A A A V V V
ICC +IIN VTH+ VHYST VTH-
Current into VCC + VIN pins Rising voltage detector threshold (see Table 7 on page 17 for detailed listing) Threshold hysteresis Falling voltage detector threshold
tPD-FALL(2) VCC falling to OUT delay
30
s
tPD-RISE(2) VCC rising to OUT delay
70
s
VIN
Voltage on VIN pin Supply for output pin
5.5
V
Output pin, OUT(3) VOUT-OH VOUT-OL IOUT Output high voltage, see Figure 11 Output low voltage Output current ISOURCE = 5 mA ISINK = 10 mA 5 VIN - 0.2 VIN 0.3 15 V V mA
Enable input, EN VEN-IH VEN-IL IEN-IN When VBUS is valid When VBUS is not valid Enable input current EN glitch immunity Inhibit input, INH VINH-IH VINH-IL VINH-IN Inhibit logic high Inhibit logic low Inhibit input current INH glitch immunity 1 1.2 0.4 0.1 V V A s 1 1.2 0.4 0.1 V V A s
1. Valid for ambient operating temperature: TA = -30C to +85C; VCC = 2.7 V to 5.5 V (except where noted). 2. Guaranteed by design. 3. For VCC below VTH-, the output remains low down to VCC = 1 V. Below VCC = 1 V the voltage VIN must be less than VOUT-OL (max.) to guarantee output low voltage less than 0.3 V.
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STM1066
Package mechanical data
6
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 12. Flip chip 6-bump, package mechanical outline
Flip chip (6-bump)
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Package mechanical data
STM1066
Table 6.
Symbol
Flip chip 6-bump, package mechanical data
mm Min Typ 0.60 0.205 0.395 0.215 1.17 0.255 1.20 0.80 0.36 0.77 0.36 0.18 0.40 0.80 0.40 0.20 0.20 0.05 0.035 0.045 0.050 0.001 0.44 0.83 0.44 0.22 0.014 0.030 0.014 0.007 0.295 1.23 0.008 0.046 Max 0.66 0.240 Min 0.021 0.007 inches Typ 0.024 0.008 0.015 0.010 0.047 0.031 0.016 0.031 0.016 0.008 0.008 0.002 0.002 0.002 0.017 0.033 0.017 0.009 0.012 0.048 Max 0.026 0.009
A A1 A2 b D D1 e E E1 SE f ccc $
0.54 0.170
Figure 13. Flip chip tape and reel specifications
Dot identifying pin A1 location 4.000.10
.05
1.5
0.2000.015
50
0.710.05
2.000.05
1.750.10 3.500.05
TxS yww
TxS yww
TxS yww
TxS yww
TxS yww
0.90 0.05
4.000.10
All dimensions in mm
User direction of unreeling
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-0.10 8.00 +0.30
1.30 0.05
STM1066
Part numbering
7
Part numbering
Table 7.
Example:
Ordering information scheme
STM1066 C35 F3 8 F
Device type STM1066
Threshold voltage (3.2 V to 3.5 V in 50 mV increments) C20: 3.20 V(1) C25: 3.25 V(1) C30: 3.30 V(1) C35: 3.35 V C40: 3.40 V(1) C45: 3.45 V(1) C50: 3.50 V(1)
Package F3: Flip chip, lead-free, pitch = 400 m, bump = 250 m
Temperature 8: -30C to 85C
Shipping method F = ECOPACK(R) package, tape & reel
1. Contact local ST sales office for availability.
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Package marking information
STM1066
8
Table 8.
Package marking information
Factory-trimmed thresholds with marking description
Rising voltage detector threshold VTH+ at ambient temperature TA from -30 to +85C Min (-3%) Typ 3.20 3.25 3.30 3.35 3.40 3.45 3.50 Max (+3%) 3.296 3.348 3.399 3.451 3.502 3.554 3.605 TAS yww TBS yww TCS yww TDS yww TES yww TFS yww TGS yww Topside marking(1)
Part number
STM1066C20F38F STM1066C25F38F STM1066C30F38F STM1066C35F38F STM1066C40F38F STM1066C45F38F STM1066C50F38F
3.104 3.152 3.201 3.249 3.298 3.346 3.395
1. Where "y" = assembly year (0 to 9) and "ww" = assembly work week (01 to 52).
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STM1066
Revision history
9
Revision history
Table 9.
Date 06-Sep-2007 03-Jan-2008 26-Mar-2008 09-Apr-2008
Document revision history
Revision 1 2 3 4 Initial release. Updated cover page, Section 1, Figure 2, 11, 13, and Table 4; added Figure 1: Logic diagram; minor text and presentation changes. Updated Table 5, 6. Document status upgraded to full datasheet; updated Figure 12. Changes
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STM1066
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